In the semiconductor news, there is always something going on in the fab, and most of the time it is about the size: what is a wafer, say, an 8-inch or 12-inch fab? Among them 8 inches, 12 inches specific refers to how much size? Let's take you to understand. A wafer is actually silicon, …
With the development of science and technology, the global chip packaging process is changing from the double-in-line through hole plug type to the surface mount package (SMT) that Kingyu semiconductor will talk about today. Surface Mounted Technology (SMT) is the most popular Technology and process in electronic assembly industry. Electronic circuit Surface Mount Technology (SMT) …
What are the differences between SMT and traditional chip packaging? Read More »
The main part of power management semiconductor is power management IC, so what is power management chip? Commonly used power management chips can be roughly summarized as the following 8, let us have a look ~ 1, AC/DC modulation IC. It contains low voltage control circuit and high voltage switching transistor. 2, DC/DC modulation IC. …
Commonly used power management chips can be summarized into eight kinds Read More »
China has the international advanced level in the field of semiconductor packaging and testing, the volume has entered the top three in the world, and there is no generation difference between technology and world-class level. It is the best one among the three links of integrated circuit, and the development speed is significantly higher than …
What is encapsulation? Briefly describe the development process Read More »
CP in chips generally refers to CP tests, also known as Chip tests. What is CP test CP test is between Wafer fabrication and packaging in the whole chip manufacturing process. The test object is for every Die in the Wafer. The purpose is to ensure that every Die in the Wafer can basically meet …
The correct choice of power adapter IC chip plays a crucial role in the adapter, the choice of adapter IC not only to meet the requirements of circuit performance, but also consider the volume, weight, service life and cost of the product, which is related to the stability and service life of the power adapter. …
Low-power power chip This section describes the power charger IC Read More »
In the face of many electronic components, how do we judge whether electronic components are qualified? Today xiaobian sorted out some points to share with you, so that you can quickly judge, let's have a look. 1, check components: model, specification, manufacturer, origin must meet the design requirements, whether the outer packaging is intact. 2, …
What are the methods for testing the appearance specifications of electronic components Read More »
The development course Electronic components industry is the foundation of the electronic information industry, the development of the electronic components in China is a process from scratch, in the 1990 s, communications equipment, consumer electronics, computers, computer, Internet technology application products, automotive electronic products, set-top boxes, and other industries has developed rapidly, with the international …
Do you know the development history and future trend of electronic components? Read More »
When electronic components fail, cause analysis is required. This analysis service is based on component analysis and testing service, which focuses on the analysis of spots, foreign bodies, flocs and oil on the surface of electronic components during production, storage and use. Due to the different fields of use, electronic components will produce different foreign …
The L6562 is a current mode PFC controller operating in transition mode (TM). Pin to pin compatible with the predecessor L6561, which offers better performance. All functions 1% (@tJ =25˚C) internal reference voltage To disable the feature DIP - 8 / SO - 8 packaging ECOPACK ® -600/+800mA totem grid driver with UVLO pull-down and …
