What are the differences between SMT and traditional chip packaging?

What are the differences between SMT and traditional chip packaging?

With the development of science and technology, the global chip packaging process is changing from the double-in-line through hole plug type to the surface mount package (SMT) that Kingyu semiconductor will talk about today. Surface Mounted Technology (SMT) is the most popular Technology and process in electronic assembly industry. Electronic circuit Surface Mount Technology (SMT)…

What are the methods for testing the appearance specifications of electronic components

What are the methods for testing the appearance specifications of electronic components

In the face of many electronic components, how do we judge whether electronic components are qualified? Today xiaobian sorted out some points to share with you, so that you can quickly judge, let's have a look. 1, check components: model, specification, manufacturer, origin must meet the design requirements, whether the outer packaging is intact. 2,…

L6562_ Transition mode

L6562_ Transition mode

The L6562 is a current mode PFC controller operating in transition mode (TM). Pin to pin compatible with the predecessor L6561, which offers better performance. All functions 1% (@tJ =25˚C) internal reference voltage To disable the feature DIP - 8 / SO - 8 packaging ECOPACK ® -600/+800mA totem grid driver with UVLO pull-down and…

Power management IC chip common classification

Power management IC chip common classification

The development of science and technology has promoted the development of power supply, so more power management chips are needed. Speaking of power management chip, as one of the chips most familiar to engineers, the so-called power management chip is a chip responsible for electrical power management in electronic equipment system, such as switching, distribution,…